Embedded continuity test circuit

ABSTRACT

An embedded continuity test circuit is provided. An integrated circuit includes a bond pad and an oscillator circuit. The oscillator circuit is configured to generate an oscillator signal having a first frequency when the bond pad is coupled to a bond region of a package and a second frequency when the bond pad is not coupled to the bond region of the package.

BACKGROUND Field

This disclosure relates generally to integrated circuits, and morespecifically, to integrated circuits with embedded continuity testcircuitry.

Related Art

Today's electronic systems are reaching new levels of sophistication andcomplexity. Many of these systems are incorporated into safety criticalapplications such as those included in transportation vehicles, forexample. Integrated circuits targeted for safety critical applicationsgenerally have redundant circuitry and are subjected to rigorous factorytesting. However, some of these factory tests consume extended test timeon expensive test equipment.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention is illustrated by way of example and is notlimited by the accompanying figures, in which like references indicatesimilar elements. Elements in the figures are illustrated for simplicityand clarity and have not necessarily been drawn to scale.

FIG. 1 illustrates, in simplified block diagram form, an examplepackaged integrated circuit in accordance with an embodiment.

FIG. 2 illustrates, in simplified block diagram form, a more detailedexample test circuit of FIG. 1 in accordance with an embodiment.

FIG. 3 illustrates, in simplified schematic diagram form, an example R-Coscillator circuit in accordance with an embodiment.

FIG. 4 illustrates, in simplified schematic diagram form, an examplering oscillator circuit in accordance with an embodiment.

FIG. 5 illustrates, in plot diagram form, example simulation results ofthe ring oscillator circuit of FIG. 4 when bond pad is unbonded inaccordance with an embodiment.

FIG. 6 illustrates, in plot diagram form, example simulation results ofthe ring oscillator circuit of FIG. 4 when bond pad is bonded inaccordance with an embodiment.

DETAILED DESCRIPTION

Generally, there is provided, a continuity test circuit embedded inintegrated circuit (IC) that can perform continuity testing without anexpensive tester. The embedded continuity test circuit allows continuitytesting in the field as well. In a test mode, the test circuit isconfigured to generate a test oscillator signal having a frequency basedon an amount of capacitance coupled at a bond pad when the bond pad isbonded to a package or other external component. An unbonded or dummybond pad is used to generate a fault reference signal frequency. Becauseof the distinct difference in capacitance between an unbonded bond padand a bonded bond pad, the test circuit is configured to test continuityof a bond pad under test by comparing the generated test oscillatorsignal frequency with the fault reference signal frequency. When thegenerated test oscillator signal frequency is approximately the same asthe fault reference signal frequency, a fault indication is provided.

FIG. 1 illustrates, in simplified block diagram form, an examplepackaged integrated circuit (IC) 100 in accordance with an embodiment.Packaged IC 100 includes an IC portion 102 coupled to a package portion104 by way of bond wire group 106 (e.g., bond wires 140-146). The IC 102includes a test circuit 108, a multiplexer 110, and a bond pad group 112(e.g., bond pads 120-126 and dummy bond pad 128). The package 104includes a bond region group 114 including bond regions 130-136. In thisembodiment, bond pads 120-126 are coupled individually to the testcircuit 108 by way of multiplexer 110. In some embodiments, each bondpad 120-126 may be coupled to respective test circuits by way ofindividual transmission gates, for example.

The bond pads 120-126 may be formed from any suitable conductivematerials at a top surface of IC 102 and configured to provideelectrical connection from IC 102 to package 104 by way of bond wires,solder bumps, and the like. The bond pads 120-126 may be part of generalpurpose input/output (GPIO) circuit structure which may be employedaround the outer perimeter of IC 102. In this embodiment, suitableelectrostatic discharge (ESD) circuitry is included in the bond pads120-126 as illustrated.

The bond regions 130-136 may include locations on a package substrate,leadframe, metal trace, and the like suitable for wire bond attachmentor other electrical connection (i.e., solder bump) between an externalpackage lead (not shown) and bond pads 120-126. In some embodiments, IC102 may be coupled to package 104 in a flip-chip configuration by way ofsolder bumps, for example.

Multiplexer 110 includes inputs labeled A through E coupled torespective pads 120-128 of pad group 112 and an output labeled PSEL. Acontrol signal labeled MUXCTRL is used to select which pad of pad group112 is coupled to the PSEL output node. In this embodiment, multiplexer110 is characterized as an analog multiplexer where capacitance at theselected pad is coupled at the PSEL node. The MUXCTRL signal may beformed as a multi-bit control signal having multiple signal lines toselect which pad is coupled to the PSEL node. For example, a 3-bitcontrol signal may be formed with 3 signal lines which can be decoded toselect one of (up to) eight pads. In this embodiment, multiplexer 110 isenabled and used during a continuity test while in a test mode.

Test circuit 108 includes an input coupled to the PSEL node and anoutput to provide a fault indication signal labeled FAULT. The testcircuit 108 includes circuitry configured to generate an oscillatorclock signal having a frequency based on the net amount of capacitancecoupled at the PSEL node. In turn, the oscillator clock signal frequencyis used to determine if a bond wire or other connection (i.e., to apackage or other external component) is intact at a pad being tested.The test circuit 108 is also configured to determine a reference signalhaving a reference frequency when generating the oscillator clock signalwith the dummy bond pad 128 coupled to the PSEL node. Because the dummybond pad 128 is not coupled to a bond region of package 104, thedetermined reference signal frequency can be used to generate a faultfrequency range. For example, the fault frequency range may be set atapproximately 80% of the determined reference signal frequency andgreater.

As depicted in the embodiment of FIG. 1, dummy bond pad 128 isessentially similar to each of bond pads 120-126, but dummy bond 128 padis unbonded (i.e., not coupled to a package or other component by way ofbond wire, solder bump, etc.). The dummy bond pad 128 has a capacitancevalue of approximately 1 picofarad (pf) in a modern process technologysuch as used in IC 102. Likewise, each of bond pads 120-126 has acapacitance value of approximately 1 pf when unbonded. In otherembodiments, bond pads 120-126 may have other capacitance values.Because, each of bond pads 120-126 has a similar capacitance to that ofdummy bond pad 128, dummy bond pad 128 can be used as a reference padfor generating the fault reference oscillator clock signal having afault reference frequency.

Each of bond regions 130-136 has a capacitance value of approximately 1pf in a modern packaging technology such as used in package 104. Inother embodiments, bond regions 130-136 may have other capacitancevalues. When bond regions 130-136 are coupled to bond pads 120-126 byway of bond wires 140-146, a net capacitance value of approximately 2 pfresults at each of bond pads 120-126. Because of the distinct differencein capacitance between an unbonded pad (e.g., dummy bond pad) and abonded pad (e.g., bond pads 120-126 coupled to a package or othercomponent by way of bond wire, solder bump, etc.), a continuity testcomparing the fault reference signal frequency with oscillator clocksignal frequencies measured at each of bond pads 120-126 provides afault indication when a measure signal frequency is within the faultfrequency range.

In operation, multiplexer 110 is configured to couple the dummy bond pad128 at the E input to the PSEL output node for determining a faultreference frequency (i.e., number of pulses in a predeterminedtimeframe). After determining the fault reference frequency, each bondpad 120-126 may be tested individually (i.e., compared with faultreference frequency) by using multiplexer 110 to select one bond padafter another to be coupled to the PSEL output node. When coupled to thePSEL output node, an oscillator clock signal is generated having afrequency based on capacitance coupled at the selected bond pad. Becausethe capacitance coupled at the PSEL node is significantly higher whenbond pads 120-126 are bonded, the oscillator clock signal generated willhave a frequency about much lower (i.e., ˜50%) than the fault referencesignal frequency. However, when the generated oscillator clock frequencyis within the fault frequency range, a fault indication is provided atthe FAULT output.

FIG. 2 illustrates, in simplified block diagram form, a more detailedexample of test circuit 108 of FIG. 1 in accordance with an embodiment.Test circuit 108 includes an oscillator circuit 202 labeled OSC, acounter circuit 204 labeled COUNTER, a frequency compare circuit 206labeled FREQ COMPARE, and a clock circuit 208 labeled CLOCK.

The oscillator circuit 202 includes an input coupled to the PSEL nodeand an output for providing an oscillator clock signal OSCCLK having afrequency based on the capacitance coupled at the PSEL node. Theoscillator circuit 202 may be any suitable oscillator (e.g., RCoscillator, ring oscillator) capable of providing an output signalhaving a frequency based on the capacitance coupled at the PSEL node.For example, when bond pad 120 is coupled to bond region 130 by way ofbond wire 140, the oscillator circuit 202 generates the OSCCLK signalhaving a frequency based on the capacitance coupled at the PSEL node(e.g., capacitance of bond pad 120 plus capacitance at bond region 130).

The counter circuit 204 includes an input coupled to receive the OSCCLKsignal and an output to provide a count value CNT signal indicative ofthe frequency of the OSCCLK signal. For example, the counter circuit 204is configured to count a number of OSCCLK pulses in a predetermined timeperiod. The number of pulses counted is provided as a CNT signal at theoutput. The CNT signal may be used to determine an absolute frequency ora relative frequency. For example, if during a test, 35 clock pulses ofOSCCLK are counted by counter circuit 204 in a 1 millisecond timeperiod, the absolute frequency of OSCCLK would be 35 MHz which could becompared with a reference signal's frequency (e.g., 70 MHz). On theother hand, comparing numbers of pulses counted over a similar timeperiod can be used to determine a relative frequency difference. Forexample, if during a second test, 25 clock pulses of OSCCLK are countedby counter circuit 204 in one time period and during a third test, 50clock pulses of OSCCLK are counted by counter circuit 204 in a similartime period, the OSCCLK frequency during the second test would beapproximately half of the OSCCLK frequency during the third test.

The frequency compare circuit 206 includes a first input coupled toreceive the CNT signal, a second input coupled to receive a high-speedclock signal from clock circuit 208, and an output for providing a faultindication signal labeled FAULT. The frequency compare circuit 206 isconfigured to store a reference frequency (e.g., reference pulse count)of OSCCLK when oscillator circuit 202 is coupled to dummy bond pad 128,for example. The reference frequency may serve as a baseline frequencycorresponding to an unbonded bond pad. The reference frequency may beprogrammed into the frequency compare circuit 206 during manufacture(e.g., programmed into ROM) or during factory testing (programmed intonon-volatile memory) of IC 102 non-volatile memory. The referencefrequency may be updated or generated on-the-fly (e.g., during a testmode operation) and stored in the frequency compare circuit 206. Thefrequency compare circuit 206 includes circuitry to compare the receivedthe CNT signal with the reference frequency to determine if a continuityerror (e.g., broken bond wire) exists. For example, if a bond pad iscoupled at the PSEL node during a continuity test, and a resultingOSCCLK frequency is within a fault frequency range based on thereference frequency, then a fault indication signal FAULT is generated.The FAULT signal indicates that an open circuit exists between the bondpad and respective bond region of package 104 due to a broken bond wire,lifted wire bond, and the like.

The clock circuit 208 includes and output for providing a clock signalFOLK to the frequency compare circuit 206. The clock circuit 208includes circuitry for generating the FOLK signal having a frequency atleast twice (e.g., 2×) possible frequencies of the OSCCLK signal. TheFOLK may be generated based on a PLL clock of the clock circuit 208 ormay be generated based on a clock provided outside of the clock circuit208.

FIG. 3 illustrates, in simplified schematic diagram form, an example RCoscillator circuit 300 in accordance with an embodiment. In thisembodiment, RC oscillator circuit 300 includes an implementation exampleof the oscillator circuit 202 of FIG. 2 having an input coupled to abond pad 310 at node PSEL during a test mode and an output for providinga corresponding OSCCLK signal. The example implementation of oscillatorcircuit 202 includes an operational amplifier (op amp) 302 and tuningresistors 304-308 coupled to bond pad 310 including correspondingcapacitances indicated by capacitors 312 and 316. An inverting input (−)of op amp 302 is coupled to bond pad 310 and a first terminal ofresistor 304 at the PSEL node. A non-inverting input (+) of op amp 302is coupled to a first terminal of resistor 306 and a first terminal ofresistor 308. An output of op amp 302 is coupled to second terminals ofresistor 304 and 306 at output node OSCCLK, and a second terminal ofresistor 308 is coupled to a first voltage supply terminal labeled GND.In this embodiment, the GND supply is configured to supply a groundvoltage or 0 volts. For illustration purposes, capacitances at bond pad310 are shown by capacitors 312 and 316. Capacitor 312 is representativeof the capacitance of bond pad 310 (e.g., bond pads 120-126) alone andcapacitor 316 is representative of package capacitance at a bond region(e.g., bond regions 130-136 of package 104). A first terminal ofcapacitor 312 is coupled at bond pad 310 and a second terminal ofcapacitor 312 is coupled at the GND supply terminal. A first terminal ofcapacitor 316 is coupled to bond pad 310 by way of conductor 314representative of a bond wire (e.g., bond wires 140-146) and a secondterminal of capacitor 316 is coupled at the GND supply terminal. In thisarrangement, the net capacitance of capacitors 312 and 316 is coupled atthe PSEL node.

FIG. 4 illustrates, in simplified schematic diagram form, an exampleGPIO circuit 400 having a ring oscillator circuit in accordance with anembodiment. In this embodiment, an example ring oscillator circuit(e.g., oscillator circuit 202) is incorporated in the GPIO circuit 400having a data out signal input labeled DOUT, a data in signal outputlabeled DIN (e.g., serves as OSCCLK in a test mode), output bufferenable signal input labeled OBE, input buffer enable signal inputlabeled IBE, pull-up/pull-down resistor control signal inputs labeledHIZ and PUPD, and mode select input labeled MODE. The GPIO circuit 400includes an output buffer circuit 402, and input buffer circuit 404,bond pad 406, pull-up and pull-down resistor circuitry (e.g., NAND gate408, NOR gate 410, inverters 412 and 426, transistors 414-416, resistors418-420), and multiplexer 428.

The output buffer circuit 402 includes a first input coupled to receivethe DOUT signal, a second input coupled to receive the OBE signal, andan output coupled to bond pad 406 by way of output path conductor 422.When enabled, output buffer circuit 402 is configured to drive an outputsignal of IC 102 by way of bond pad 406. The input buffer circuit 404includes a first input coupled to bond pad 406 by way of input pathconductor 424, a second input coupled to receive the IBE signal, and anoutput coupled to provide the DIN signal in a normal mode and OSCCLKsignal in a test mode. When enabled, the input buffer circuit 404 isconfigured to transfer a received input signal at bond pad 406 tointernal circuitry of IC 102. The input buffer circuit 404 is configuredto include hysteresis circuitry (e.g., a Schmitt trigger circuit). Theoutput of the input buffer circuit 404 is coupled to an input ofinverter 426 and an output of inverter 426 is coupled to a first inputof multiplexer 428 at node labeled ROSC. A second input of multiplexer428 is coupled to receive the PUPD control signal and a select input ofmultiplexer is coupled to receive the MODE signal. An output ofmultiplexer 428 is coupled to first inputs of NAND and NOR gates 408 and410 at node labeled MXO. A second input of NOR gate 410 and an input ofinverter 412 are coupled to receive the HIZ control signal. A secondinput of NAND gate 408 is coupled to an output of inverter 412 and anoutput of NAND gate 408 is coupled to a control electrode of P-channeltransistor 414 at node labeled PU. A first current electrode oftransistor 414 is coupled to a first terminal of pull-up resistor 418and a second terminal of resistor 418 is coupled to a second voltagesupply terminal labeled VDD. In this embodiment, the VDD supply isconfigured to supply a nominal or normal operating voltage. An output ofNOR gate 410 is coupled to a control electrode of N-channel transistor416 at node labeled PD. A first current electrode of transistor 416 iscoupled to a first terminal of pull-down resistor 420 and a secondterminal of resistor 420 is coupled to the GND supply terminal. Secondcurrent electrodes of transistors 414 and 416 are coupled at conductor422. In this embodiment, resistors 418 and 420 may have resistancevalues in a range of 10 k to 100 k ohms. In other embodiments, resistors418 and 420 may have other resistance values.

For illustration purposes, capacitances at bond pad 406 are shown bycapacitors 430 and 434. Capacitor 430 is representative of thecapacitance of bond pad 406 (e.g., bond pads 120-126) alone andcapacitor 434 is representative of package capacitance at a bond region(e.g., bond regions 130-136 of package 104 and parasitic capacitance). Afirst terminal of capacitor 430 is coupled at bond pad 406 and a secondterminal of capacitor 430 is coupled at the GND supply terminal. A firstterminal of capacitor 434 is coupled to bond pad 406 by way of conductor432 representative of a bond wire (e.g., bond wires 140-146) and asecond terminal of capacitor 434 is coupled at the GND supply terminal.In this arrangement, the net capacitance of capacitors 430 and 434 iscoupled at the bond pad 406 which corresponds to the PSEL node ofoscillator 202, for example.

In a test mode, a continuity test may be performed while GPIO circuit400 is configured as a ring oscillator utilizing the capacitance coupledat bond pad 406. When configured as a ring oscillator, output buffer 402is disabled, input buffer 404 is enabled, multiplexer 428 is configuredto couple ROSC input to MXO output, and the HIZ control signal isde-asserted (e.g., logic low). In this configuration, an input path(e.g., conductor 424 having one end coupled at bond pad 406) is coupledto an output path (e.g., conductor 422 having one end coupled at bondpad 406) in a ring having an odd number of inverting stages (e.g.,inverter 426 stage, NAND/NOR stage, and inverter stage formed bytransistors 414-416 and resistors 418-420). When configured as a ringoscillator, conductors 422 and 424 together correspond to the PSEL nodeand the DIN signal corresponds to the OSCCLK output as depicted inoscillator circuit 202 of FIG. 2. Because an odd number of invertingstages are formed between the input path and output path, the ringoscillator oscillates and generates an OSCCLK signal at the output ofinput buffer circuit 404. The OSCCLK signal has a frequency dependentupon the net amount of capacitance coupled at bond pad 406. Accordingly,the continuity test compares the OSCCLK frequency with a referencefrequency determined when a bond pad is unbonded. If the OSCCLKfrequency is much lower (e.g., 50% of the reference frequency) than thereference frequency, then the bond pad 406 is determined to be properlyconnected to a package bonding region. However, if the OSCCLK frequencyis approximately the same as the reference frequency, then the bond pad406 is determined to be not connected to a package bonding region andthus, generating a fault indication.

FIG. 5 illustrates, in plot diagram form, example simulation result ofthe ring oscillator circuit configuration of FIG. 4 in accordance withan embodiment. The plot diagram 500 includes voltage waveforms of theOSCCLK, PAD, and ROSC signals when bond pad 406 is unbonded (i.e., notcoupled to a package) versus time shown in nanoseconds (ns) on theX-axis. At about the 100 ns time in the simulation, the ring oscillatoris enabled allowing the PAD signal (i.e., taken at bond pad 406) tooscillate based on the net amount of capacitance coupled at bond pad406. The resulting OSCCLK and ROSC signal waveforms show fullrail-to-rail signals corresponding to the PAD signal. The absolutefrequency of the OSCCLK signal is determined by taking the inverse ofthe OSCCLK period from time marker t1 to time marker t2. In thisexample, the OSCCLK signal has a period of approximately 13.5 ns and afrequency of approximately 74 MHz. A relative frequency is determined bycounting a number of OSCCLK signal pulses over a predeterminedtimeframe. For example, 8 pulses of the OSCCLK signal may be countedover the timeframe from 110 ns to 220 ns. By counting signal pulses,relative frequencies of signals can be compared without complexmathematical circuitry as required when determining and comparingabsolute frequencies of signals. Because bond pad 406 is unbonded inthese examples, the absolute frequency (i.e., ˜74 MHz) and relativefrequency (i.e., 8 pulses over 110 ns) may be used as a fault referencefrequency or count. The fault reference frequency or count may beadjusted by a suitable margin to form a fault reference frequency rangeor fault count range. For example, the fault frequency range or countmay be set at approximately 50% of the fault reference frequency orfault count and greater (i.e., ˜37 MHz and greater, 4 pulses and greaterover 110 ns). In some embodiments, the fault frequency range or countmay be set at approximately 80% of the fault reference frequency orfault count and greater (i.e., ˜59 MHz and greater, 6 pulses and greaterover 110 ns).

FIG. 6 illustrates, in plot diagram form, example simulation result ofthe ring oscillator circuit configuration of FIG. 4 when bond pad 406 isbonded in accordance with an embodiment. The plot diagram 600 includesvoltage waveforms of the OSCCLK, PAD, and ROSC signals when bond pad 406is bonded (i.e., coupled to a package) versus time shown in nanoseconds(ns) on the X-axis. At about the 100 ns time in the simulation, the ringoscillator is enabled allowing the PAD signal (i.e., taken at bond pad406) to oscillate based on the net amount of capacitance coupled at bondpad 406. The resulting OSCCLK and ROSC signal waveforms show fullrail-to-rail signals corresponding to the PAD signal. The absolutefrequency of the OSCCLK signal is determined by taking the inverse ofthe OSCCLK period from time marker t1 to time marker t2. In thisexample, the OSCCLK signal has a period of approximately 30 ns and afrequency of approximately 33 MHz. A relative frequency is determined bycounting a number of OSCCLK signal pulses over the predetermined 110 nstimeframe. For example, 3 pulses of the OSCCLK signal may be countedover the timeframe from 110 ns to 220 ns. Because bond pad 406 is bondedin these examples, the absolute frequency (i.e., ˜33 MHz) and relativefrequency (i.e., 3 pulses over 110 ns) are much lower due to theaddition of package capacitance coupled at bond pad 406. Here, theabsolute frequency (i.e., ˜33 MHz) and relative frequency (i.e., 3pulses over 110 ns) do not fall in the fault frequency range (i.e., ˜37MHz and greater) or count (i.e., 4 pulses and greater over 110 nstimeframe) when set at approximately 50% of the fault referencefrequency or fault count and greater.

In one embodiment, there is provided, an integrated circuit including afirst bond pad; and an oscillator circuit configured to generate anoscillator signal having a first frequency when the first bond pad iscoupled to a bond region of a package and a second frequency when thefirst bond pad is not coupled to the bond region of the package. Theintegrated circuit may further include a counter circuit coupled toreceive the oscillator signal, the counter circuit configured to countpulses of the oscillator signal. The integrated circuit may furtherinclude a compare circuit configured to generate a fault indication whenthe oscillator signal has a frequency within a fault frequency range,the fault frequency range set at approximately 80% of the secondfrequency and greater. The integrated circuit may further include adummy bond pad, the first bond pad and the dummy bond pad selectivelycoupled to the oscillator circuit by way of a multiplexer circuit. Theoscillator circuit may generate the oscillator signal having the secondfrequency when coupled to the dummy bond pad. The oscillator circuit maybe characterized as a ring oscillator including an input path having afirst end coupled at the first bond pad and an output path having afirst end coupled at the first bond pad, the input path coupled to theoutput path by way of an odd number of inverting stages. The oscillatorcircuit may be characterized as an RC oscillator configured to generatethe oscillator signal having the first frequency and the secondfrequency by utilizing the capacitance coupled at the first bond pad.The first bond pad may be coupled to the bond region of the package byway of a bond wire. The oscillator circuit may be configured to generatethe oscillator signal during a test mode.

In another embodiment, there is provided, an integrated circuitincluding a first bond pad; an oscillator circuit coupled at the firstbond pad, the oscillator circuit configured to generate an oscillatorsignal having a first frequency based on a capacitance coupled at thefirst bond pad; and a compare circuit configured to generate a faultindication when the first frequency is within a fault frequency range.The fault frequency range may be based on the generated oscillatorsignal having a second frequency, the second frequency based on thecapacitance when the first bond pad is not coupled to a bond region of apackage. The fault frequency range may be approximately 80% of thesecond frequency and greater. The first frequency may be based on thecapacitance when the first bond pad is coupled to the bond region of thepackage, the first frequency being less than the second frequency. Theoscillator circuit may be characterized as a ring oscillator includingan input path having a first end coupled at the first bond pad and anoutput path having a first end coupled at the first bond pad, the inputpath coupled to the output path by way of an odd number of invertingstages. The oscillator circuit may be characterized as an RC oscillatorconfigured to generate the oscillator signal having the first frequencyby utilizing the capacitance coupled at the first bond pad. Theoscillator circuit may be configured to generate the oscillator signalduring a continuity test while in a test mode.

In yet another embodiment, there is provided, an integrated circuitincluding a plurality of bond pads; a multiplexer circuit having anoutput and a plurality of inputs, each input coupled to a respectivebond pad of the plurality of bond pads; an oscillator circuit coupled tothe output of the multiplexer, the oscillator circuit configured togenerate an oscillator signal having a first frequency based on acapacitance coupled at the output of the multiplexer; and a comparecircuit configured to generate a fault indication when the firstfrequency is within a fault frequency range. The multiplexer may beconfigured to electrically couple a first bond pad of the plurality tothe multiplexer output based on a control signal during a test mode. Themultiplexer may be further configured to electrically couple a dummybond pad to the multiplexer output based on the control signal, theoscillator circuit configured to generate the oscillator signal having asecond frequency, the fault frequency range set at approximately 80% ofthe second frequency and greater. The oscillator circuit may becharacterized as an RC oscillator configured to generate the oscillatorsignal by utilizing the capacitance coupled at the output of themultiplexer.

By now it should be appreciated that there has been provided, acontinuity test circuit embedded in integrated circuit (IC) that canperform continuity testing without an expensive tester. The embeddedcontinuity test circuit allows continuity testing in the field as well.In a test mode, the test circuit is configured to generate a testoscillator signal having a frequency based on an amount of capacitancecoupled at a bond pad when the bond pad is bonded to a package or otherexternal component. An unbonded or dummy bond pad is used to generate afault reference signal frequency. Because of the distinct difference incapacitance between an unbonded bond pad and a bonded bond pad, the testcircuit is configured to test continuity of a bond pad under test bycomparing the generated test oscillator signal frequency with the faultreference signal frequency. When the generated test oscillator signalfrequency is approximately the same as the fault reference signalfrequency, a fault indication is provided.

Because the apparatus implementing the present invention is, for themost part, composed of electronic components and circuits known to thoseskilled in the art, circuit details will not be explained in any greaterextent than that considered necessary as illustrated above, for theunderstanding and appreciation of the underlying concepts of the presentinvention and in order not to obfuscate or distract from the teachingsof the present invention.

Although the invention is described herein with reference to specificembodiments, various modifications and changes can be made withoutdeparting from the scope of the present invention as set forth in theclaims below. Accordingly, the specification and figures are to beregarded in an illustrative rather than a restrictive sense, and allsuch modifications are intended to be included within the scope of thepresent invention. Any benefits, advantages, or solutions to problemsthat are described herein with regard to specific embodiments are notintended to be construed as a critical, required, or essential featureor element of any or all the claims.

Furthermore, the terms “a” or “an,” as used herein, are defined as oneor more than one. Also, the use of introductory phrases such as “atleast one” and “one or more” in the claims should not be construed toimply that the introduction of another claim element by the indefinitearticles “a” or “an” limits any particular claim containing suchintroduced claim element to inventions containing only one such element,even when the same claim includes the introductory phrases “one or more”or “at least one” and indefinite articles such as “a” or “an.” The sameholds true for the use of definite articles.

Unless stated otherwise, terms such as “first” and “second” are used toarbitrarily distinguish between the elements such terms describe. Thus,these terms are not necessarily intended to indicate temporal or otherprioritization of such elements.

What is claimed is:
 1. A packaged integrated circuit including a packageportion and an integrated circuit portion, the packaged integratedcircuit comprising: a first bond pad of the integrated circuit portion;an oscillator circuit configured to generate an oscillator signal havinga first frequency when the first bond pad is coupled to a bond region ofthe package portion and a second frequency when the first bond pad isnot coupled to the bond region of the package; and a dummy bond pad, thefirst bond pad and the dummy bond pad selectively coupled to theoscillator circuit by way of a multiplexer circuit.
 2. The packagedintegrated circuit of claim 1, further comprising a counter circuitcoupled to receive the oscillator signal, the counter circuit configuredto count pulses of the oscillator signal.
 3. The packaged integratedcircuit of claim 1, further comprising a compare circuit configured togenerate a fault indication when the oscillator signal has a frequencywithin a fault frequency range, the fault frequency range set atapproximately 80% of the second frequency and greater.
 4. The packagedintegrated circuit of claim 1, wherein the oscillator circuit generatesthe oscillator signal having the second frequency when coupled to thedummy bond pad.
 5. The packaged integrated circuit of claim 1, whereinthe oscillator circuit is characterized as a ring oscillator includingan input path having a first end coupled at the first bond pad and anoutput path having a first end coupled at the first bond pad, the inputpath coupled to the output path by way of an odd number of invertingstages.
 6. The packaged integrated circuit of claim 1, wherein theoscillator circuit is characterized as an RC oscillator configured togenerate the oscillator signal having the first frequency and the secondfrequency by utilizing the capacitance coupled at the first bond pad. 7.The packaged integrated circuit of claim 1, wherein the first bond padis coupled to the bond region of the package by way of a bond wire. 8.The packaged integrated circuit of claim 1, wherein the oscillatorcircuit is configured to generate the oscillator signal during a testmode.
 9. A packaged integrated circuit including a package portion andan integrated circuit portion, the packaged integrated circuitcomprising: a first bond pad of the integrated circuit portion; anoscillator circuit coupled at the first bond pad, the oscillator circuitconfigured to generate an oscillator signal having a first frequencybased on a capacitance coupled at the first bond pad; and a comparecircuit configured to generate a fault indication when the firstfrequency is within a fault frequency range; wherein the oscillatorcircuit is characterized as a ring oscillator including an input pathhaving a first end coupled at the first bond pad and an output pathhaving a first end coupled at the first bond pad, the input path coupledto the output path by way of an odd number of inverting stages.
 10. Thepackaged integrated circuit of claim 9, wherein the fault frequencyrange is based on the generated oscillator signal having a secondfrequency, the second frequency based on the capacitance when the firstbond pad is not coupled to a bond region of a package.
 11. The packagedintegrated circuit of claim 10, wherein the fault frequency range isapproximately 80% of the second frequency and greater.
 12. The packagedintegrated circuit of claim 10, wherein the first frequency is based onthe capacitance when the first bond pad is coupled to the bond region ofthe package, the first frequency being less than the second frequency.13. The packaged integrated circuit of claim 9, wherein the oscillatorcircuit is characterized as an RC oscillator configured to generate theoscillator signal having the first frequency by utilizing thecapacitance coupled at the first bond pad.
 14. The packaged integratedcircuit of claim 9, wherein the oscillator circuit is configured togenerate the oscillator signal during a continuity test while in a testmode.
 15. A packaged integrated circuit including a package portion andan integrated circuit portion, the packaged integrated circuitcomprising: a plurality of bond pads of the integrated circuit portion;a multiplexer circuit having an output and a plurality of inputs, eachinput coupled to a respective bond pad of the plurality of bond pads,the multiplexer configured to electrically couple a first bond pad ofthe plurality to the multiplexer output based on a control signal duringa test mode; an oscillator circuit coupled to the output of themultiplexer, the oscillator circuit configured to generate an oscillatorsignal having a first frequency based on a capacitance coupled at theoutput of the multiplexer; and a compare circuit configured to generatea fault indication when the first frequency is within a fault frequencyrange; wherein the multiplexer is further configured to electricallycouple a dummy bond pad to the multiplexer output based on the controlsignal, the oscillator circuit configured to generate the oscillatorsignal having a second frequency, the fault frequency range set atapproximately 80% of the second frequency and greater.
 16. The packagedintegrated circuit of claim 15, wherein the oscillator circuit ischaracterized as an RC oscillator configured to generate the oscillatorsignal by utilizing the capacitance coupled at the output of themultiplexer.
 17. A packaged integrated circuit including a packageportion and an integrated circuit portion, the packaged integratedcircuit comprising: a first bond pad of the integrated circuit portion;and an oscillator circuit of the integrated circuit portion configuredto generate an oscillator signal having a first frequency when the firstbond pad is coupled to a bond region of the package portion and a secondfrequency when the first bond pad is not coupled to the bond region ofthe package portion; wherein the oscillator circuit is characterized asa ring oscillator including an input path having a first end coupled atthe first bond pad and an output path having a first end coupled at thefirst bond pad, the input path coupled to the output path by way of anodd number of inverting stages.
 18. The packaged integrated circuit ofclaim 17, further comprising a counter circuit coupled to receive theoscillator signal, the counter circuit configured to count pulses of theoscillator signal.
 19. The packaged integrated circuit of claim 17,further comprising a compare circuit configured to generate a faultindication when the oscillator signal has a frequency within a faultfrequency range, the fault frequency range set at approximately 80% ofthe second frequency and greater.
 20. The packaged integrated circuit ofclaim 17, wherein the oscillator circuit generates the oscillator signalhaving the second frequency when coupled to the dummy bond pad.